At the 2017 European 3D Summit in Grenoble (Jan. 23-25), imec and EV Group (EVG), a leading supplier of wafer-bonding equipment, announce an extension to their collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding.   Expanding this collaboration, EVG will become a partner in imec’s 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.   Wafer-to-wafer bondi...